9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
9504 One-Component Pre-Curing Type Thermal Gel, which hasno residual stress after sizing, effectivelyprotects precision electronic componentsfrom damageProduct DescriptionPink paste gelOne-part pre-curing typeSilicone thermal conductivity complexProduct Features:High thermal conductivity 4W/m∙KVery small BLT and very low thermalresistanceSoft adhesion and self-adhesive propertiesafter dispensingExcellent chemical and mechanical stabilityNo residual stress after sizing, effectivelyprotects precision electronic componentsfrom damageTechnical ParametersReference standardItemUnitValueGB/T 13354Densityg/cm33.2–Extrusion rate(30ccEFD@90psi)g/min30ISO22007Thermal conductivityW/ m·K4.0GB/T2408Flame retardant/V0GB/T2408Volume resistivityΩ·cm≥1.0×1013ASTM D149Dielectric strengthKv/mm8.0ASTM D5470Minimum thicknessmm0.1Main Applications:Bare die chip low-stress mountingHeat dissipation field of 5G communication boardsAutomotive electronic equipmentSmart phone modules and consumer-electronicsOther high-value boards need to be reworkedPacking:30cc/tube; 300cc/tubeStorage:Store below 35°C in a cool and dry place.Shelf life is 6 months.
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