5297 Two Part Addition Type Potting Adhesive 1.5 W/M·K Thermal Conductive Flame Retardant

5297 is a 1:1 two-component addition-type potting silicone rubber, with 1.5 W /m·K thermal conductive, flame retardant.ApplicationsAll kinds of electrical components of thermal conductivity, flame retardant potting, such as photovoltaic inverters, LED drive power.charging piles, automotive electronics, NEV power, controllers etc.Product Features1)High thermal conductivity and flowability2)Both room temperature and heat curing3)Good weather and aging resistance4)Excellent insulation properties5)Flame retardant UL94V-06)Maintains rubber elasticity from -50°C to 200°C7)RoHS DirectiveTechnical parametersReference standard1ItemUnitValueProperties before curing(25±2℃,60±5%RH)Q/HTXC 2Appearance(A)-Grey fluidAppearance (B)-White fluidGB/T2794Viscosity (A)mPa·s3,500-4,500Viscosity (B)mPa·s3,000-4,000GB/T13354Viscosity (A)g/cm32.55±0.05Viscosity (B)g/cm32.55±0.05Properties after curing(25±2℃,60±5%RH,A:B=1:1)Q/HTXC 2Operating timemin＞30Q/HTXC 2Curing time (25℃)h≤3Q/HTXC 2Curing time (80℃)min30GB/T 531Hardness (Shore A)–30-40Q/HTXC 2Dielectric strengthKV/mm≥18Q/HTXC 2Volume resistivityΩ·cm≥1.0×1014GB/T 528-92Tensile StrengthMPa0.94GB/T 528-92Elongation%56GB/T 7124Shear StrengthMPa0.7GB/T 1034Water absorption%＜0.1ISO 22007-2Thermal conductivityW/(m·K)1.5±0.1ASTM E831CLTE @25-150℃μm/(m·℃)162.6CautionsStore the product in a sealed container, and keep it away from children for storage.The glue will not cure if exposed to a certain amount of the following chemicals:Organic compounds of N, P, and S, ionic compounds of Sn, Pb, Hg, As, etc.;Compounds containing alkyne and polyvinyl.To avoid the above problem, Any residual rosin on the circuit board should be wiped clean when using the glue, and use soldering tin with low lead content.This product is non-hazardous. Please consult the MSDS of the product for safety information.Packaging20kg/barrelHuitian Addition-type potting production line